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© All Rights Reserved. ApplyBlast.com
WSP
The Lead Underground Paste Backfill Engineer provides technical leadership and management for underground paste backfill systems, serving as the primary interface between surface plants, underground operations, and various engineering disciplines. This role ensures safe, reliable, and cost-effective project execution through design, construction support, and commissioning. The position requires strong engineering management skills and subject matter expertise in paste reticulation systems.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for WSP.
WSP didn’t post a salary, so this is our estimate from similar listings.
23% below the average for this role