skhynixamerica.com
SK hynix America is seeking a Mechanical Simulation Engineer to join the Advanced Packaging R&D team, focusing on the mechanical integrity of next-generation semiconductor packaging solutions. The role involves utilizing advanced numerical methods to predict and optimize the thermos-mechanical behavior of complex IC packages, ensuring high performance and structural robustness. Additionally, the engineer will bridge the gap between package-level integrity and system-level performance to ensure robust integration into data center and consumer systems.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for skhynixamerica.com.
110% above the average for this role
Thermo-Mechanical Simulation Engineer
onsemi
Thermo-Mechanical Simulation Engineer
Oracle
Mechanical Simulation Engineer
Micron Technology
Senior Or Staff Ic Packaging Engineer Mechanical Simulation Hsinchu City Hsinchu City Taiwan
Qualcomm Incorporated
Intern, IC Packaging Thermal Analysis (Summer 2026)
SK hynix
Thermo-Mechanical Simulation Engineer
Lightmatter