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© All Rights Reserved. ApplyBlast.com
Kandou
Kandou is redefining AI infrastructure economics by developing energy-efficient high-bandwidth interconnects that enable scalable AI hardware. They focus on innovative solutions that significantly reduce power consumption while supporting large-scale AI training and inference.
Kandou AI develops revolutionary Copper MIMO (Chord Signaling) interconnect technology that unlocks the full potential of copper links for AI infrastructure. Their technology reimagines how memory, compute, and rack-scale connectivity work together, delivering over 10X lower cost, 3X lower power, and 8X more scale compared to traditional approaches. Kandou's products span PCIe retimers, USB4 retimers, PCIe switches, and chiplet interconnect IP targeting AI inference, CXL memory platforms, and high-speed networking applications.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Kandou.
Kandou didn’t post a salary, so this is our estimate from similar listings.
9% above the average for this role
Technical Advisor/ Principal Architect, Office of the CTO
Kandou AI (formerly Kandou Bus) is a semiconductor company on a mission to democratize Artificial Intelligence by delivering affordable, scalable, and energy-efficient AI hardware solutions. Powered by their proprietary Copper MIMO interconnect technology, they provide chiplet-based AI fabric solutions across GPU, Memory, Network, and Rack connectivity. Their products enable customers worldwide to build massively scalable AI systems at significantly reduced cost.
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Kandou AI (formerly Kandou Bus) is a semiconductor company on a mission to democratize Artificial Intelligence by delivering affordable, scalable, and energy-efficient AI hardware solutions. Powered by their proprietary Copper MIMO interconnect technology, they provide chiplet-based AI fabric solutions across GPU, Memory, Network, and Rack connectivity. Their products enable customers worldwide to build massively scalable AI systems at significantly reduced cost.
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