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Module Process Engineer (Advanced Packaging) at Applied Materials - ApplyBlast

Module Process Engineer (Advanced Packaging)

Applied Materials

9 months ago

3.9 on Glassdoor

Singapore

Onsite

Full Time

Medior

0 applicants

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About this role

Applied Materials is hiring a Process Engineer in Singapore to support next-generation semiconductor and display manufacturing technologies. The role is based at Science Park II (with a planned move to Tampines by end-2026) and supports setup and ramp of a next-generation semiconductor Nanospace, partnering closely with internal R&D and cross-functional teams. This is a full-time regular position within a global materials engineering leader serving the semiconductor and advanced display markets.

Skills

Qualifications

PhDMaster's DegreeBachelor's Degree

About Applied Materials

appliedmaterials.com

Headquarters

Santa Clara, California, United States

Company Size

10001+ employees

Founded

1967

View Profile

Applied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.