ASTARPRD
This role focuses on supporting optical interconnect integration using 2.5D and 3D advanced packaging approaches for Co-Packaged Optics (CPO) and heterogeneous integration platforms. The position involves developing package-level and wafer-level optical solutions, performing optical simulations, and characterizing fabricated structures to assess performance and alignment tolerances. Collaboration with internal teams and external partners is essential to coordinate fabrication, assembly, and validation of optical interconnect test vehicles.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for ASTARPRD.
ASTARPRD didn’t post a salary, so this is our estimate from similar listings.
26% below the average for this role