Package Design Engineer

France Cars SAS AAA(2 months ago)

San Jose, CAOnsiteFull TimeSenior$141,300 - $226,000Hardware Engineering

About this role

Broadcom is hiring an experienced IC package-design engineer to develop complex flip-chip BGA package designs for high-performance ASICs. The role sits within a global R&D organization supporting advanced silicon used in AI, networking, HPC, and 5G applications, with exposure to cutting-edge interfaces like high-speed SerDes and advanced memory. You will work closely with internal teams and external partners to enable new package structures and improve design-team efficiency.

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Required Skills

Flip-Chip BGA
Package Design
Signal Integrity
Power Integrity
Thermal Analysis
Reliability Engineering
Manufacturability
SerDes
ADC/DAC
HBM

+10 more

Qualifications

BSEE
MSEE

About France Cars SAS AAA

bloomberg.com

Bloomberg is a global leader in financial information and technology, providing data, news, and analytics to financial professionals around the world. The company offers an array of products and services, including the Bloomberg Terminal, which delivers real-time data and insights for trading, investment, and risk management. With a commitment to innovation, Bloomberg combines cutting-edge technology with extensive market expertise to empower financial professionals in making informed decisions.

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