Package Design Engineer
Broadcom
About this role
Broadcom is hiring an experienced IC package-design engineer to develop complex flip-chip BGA package designs for high-performance ASICs. The role sits within a global R&D organization supporting advanced silicon used in AI, networking, HPC, and 5G applications, with exposure to cutting-edge interfaces like high-speed SerDes and advanced memory. You will work closely with internal teams and external partners to enable new package structures and improve design-team efficiency.
Skills
Qualifications
About Broadcom
broadcom.comBroadcom Inc. is a global technology leader that designs, develops, and supplies a comprehensive range of semiconductor and enterprise software solutions. The company's offerings include a variety of security solutions and products aimed at enhancing connectivity across various sectors. With a commitment to innovation and quality, Broadcom is at the forefront of driving technological advancements that connect everything, from data centers to mobile devices.
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About Broadcom
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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View leadership team, funding history,
and employee contacts for Broadcom.
Salary
$141k – $226k
per year
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