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Package Design Engineer at Broadcom - ApplyBlast

Package Design Engineer

Broadcom

10 months ago

3.3 on Glassdoor

San Jose, CA

Onsite

Full Time

Senior

0 applicants

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About this role

Broadcom is hiring an experienced IC package-design engineer to develop complex flip-chip BGA package designs for high-performance ASICs. The role sits within a global R&D organization supporting advanced silicon used in AI, networking, HPC, and 5G applications, with exposure to cutting-edge interfaces like high-speed SerDes and advanced memory. You will work closely with internal teams and external partners to enable new package structures and improve design-team efficiency.

Skills

Qualifications

BSEEMSEE

About Broadcom

broadcom.com

Headquarters

Palo Alto, California, United States

Company Size

10001+ employees

Founded

1991

View Profile

Broadcom Inc. is a global technology leader that designs, develops, and supplies a comprehensive range of semiconductor and enterprise software solutions. The company's offerings include a variety of security solutions and products aimed at enhancing connectivity across various sectors. With a commitment to innovation and quality, Broadcom is at the forefront of driving technological advancements that connect everything, from data centers to mobile devices.