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© All Rights Reserved. ApplyBlast.com
Teradyne
Teradyne is seeking a Package Design Engineer to support advanced measurement ASIC products within the Semiconductor Test Division. The role leads signal and power integrity architecture, develops package and PCB constraints, and collaborates with cross‑functional teams to ensure high‑performance mixed‑signal, RF, and serial‑link solutions.
Headquarters
North Reading, Massachusetts, United States
Company Size
5001-10000 employees
Founded
1960
Teradyne offers cutting-edge technological solutions for modern problems through innovation expertise. Stay connected with Teradyne’s offerings. Learn more.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Teradyne.
68% above the average for this role
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