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© All Rights Reserved. ApplyBlast.com
SPD Technology
The Package Design Engineer role involves developing custom silicon solutions and advanced 2.5D/3.5D packaging technologies for high-performance ML and AI chips. The position focuses on optimizing package substrate architecture for electrical performance, reliability, and manufacturability while collaborating with cross-functional engineering teams. This role supports the deployment of advanced computing systems in large-scale data center environments to enhance system performance and efficiency.
SPD Technology is a global custom software development company specialized in Fintech and Payment, AI/ML, Data and Cloud solutions. AWS Services partner
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for SPD Technology.
SPD Technology didn’t post a salary, so this is our estimate from similar listings.
22% below the average for this role