Package Design Intern
Marvell Technology(25 days ago)
About this role
An internship within Marvell’s package engineering group supporting IC packaging across enterprise, cloud/AI, and carrier products. The role contributes to package interconnect design, modeling, and verification efforts for semiconductor solutions. It is targeted at students pursuing a bachelor’s degree in electronics, computer science, or related technical fields.
Required Skills
- Package Design
- EM Simulation
- Signal Integrity
- Power Integrity
- PCB Routing
- Transmission Lines
- Microwave Theory
- Frequency Analysis
- Time Domain
- Layout
+4 more
Qualifications
- Bachelor's Degree (In Progress)
About Marvell Technology
marvell.comDesigned for your current needs and future ambitions, Marvell delivers the data infrastructure technology transforming tomorrow’s enterprise, cloud, automotive, and carrier architectures for the better.
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