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© All Rights Reserved. ApplyBlast.com
Black Semiconductor GmbH
The Package Reliability Engineer will own the reliability of packaged semiconductor products, defining mission profiles, reliability targets, and qualification strategies, while leading failure analysis and providing data‑driven release recommendations. The role collaborates closely with package architecture, device reliability, product engineering, and external OSAT and laboratory partners.
Headquarters
Aachen, North Rhine-Westphalia, Germany
Company Size
11-50 employees
Founded
2020
Black Semiconductor builds Integrated Graphene Photonics Technology that allows high-speed graphene photonics to be integrated directly onto electronic chips. This on-chip optical capability is designed to rethink compute architectures and accelerate data processing by bringing photonics closer to silicon circuits. Founded in 2020 by Daniel Schall and Sebastian Schall, the company brands itself with the slogan, “We connect chips. You create the impossible.” Their technology aims to empower innovators to push beyond traditional chip limits by embedding graphene photonics into compute hardware.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Black Semiconductor GmbH.