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marvellsemiconductor.com
The role leads silicon, package, PCB, and system co-design efforts for Marvell's Photonic Fabric Business unit, overseeing advanced packaging feasibility, layout, and validation for multi-chip SiP solutions. The engineer collaborates with ASIC/PIC designers, substrate vendors, and OSATs to deliver high‑speed, reliable packages and drive innovation in advanced packaging technologies.
Headquarters
Santa Clara, California, United States
Company Size
1001-5000 employees
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for marvellsemiconductor.com.
77% above the average for this role