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Packaging Design Integration Engineer at GlobalFoundries - ApplyBlast

Packaging Design Integration Engineer

GlobalFoundries

2 months ago

3.5 on Glassdoor

Essex Junction, Vermont, United States

Onsite

Full Time

Junior

0 applicants

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About this role

The role is for a new college graduate to join GlobalFoundries' Advanced Packaging and Silicon Photonics team, supporting chip package co-design activities for electro‑optical transceivers using the Photonix platform and advanced 2.5D/3D packaging technologies. The engineer will assist with thermal, mechanical, electrical, and optical integration, design rule development, and manufacturability assessments while collaborating across cross‑functional teams.

Responsibilities

Support packaging design integration for silicon photonics and advanced packaging products
Assist with thermal, mechanical, electrical, and optical chip package co‑design analysis
Develop design rules, manufacturability assessments, and design review documentation

Skills

Qualifications

Bachelor’s degree in Mechanical EngineeringMaster’s degree in Mechanical EngineeringPhD degree in Mechanical Engineering

About GlobalFoundries

gf.com

Headquarters

Malta, New York, United States

Company Size

10001+ employees

Founded

2009

View Profile

GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.