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onsemi
We are seeking an experienced Packaging Designer to lead the design, development, and optimization of advanced power module packaging solutions. The role requires extensive expertise in Advanced Package Design (APD) and 3D modeling, along with a deep understanding of power module design requirements. This position involves collaborating with cross-functional engineering teams to develop innovative packaging solutions for high-performance, reliable, and manufacturable power electronic products.
The leader in intelligent power and image sensing technologies that build a better future for the automotive, industrial, cloud, medical, and IoT markets
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for onsemi.
onsemi didn’t post a salary, so this is our estimate from similar listings.