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oraclecloudinfrastructure
The Packaging Development Engineer leads the design and development of next-generation optical and silicon photonics packaging solutions, collaborating with cross-functional teams to optimize assembly and ensure a smooth transition to mass production. This role involves owning advanced packaging activities, driving debug efforts during validation, and supporting contract manufacturers to meet production volumes and cost targets. The position requires expertise in high-speed electronics, microelectronics, and optoelectronics packaging processes.
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Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for oraclecloudinfrastructure.