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oraclecloudinfrastructure
The Packaging Development Engineer leads the design and development of next-generation optical package solutions, collaborating with cross-functional teams to optimize electrical assembly and RF signal efficiency. This role involves driving the transition from design to mass production while ensuring compliance with manufacturing documentation and quality standards. The position requires expertise in advanced packaging technologies and processes to support high-volume production of optical transceivers and related modules.
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Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for oraclecloudinfrastructure.