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© All Rights Reserved. ApplyBlast.com
Rochester
The Packaging Engineer II at Rochester Electronics is responsible for executing semiconductor packaging projects, providing package design, materials development, and sustaining support for semiconductor assemblies. The role involves managing material suppliers, ensuring high‑reliability applications, and collaborating with program managers, engineering, quality, OSAT, and suppliers to deliver robust components.
The world’s largest continuous source of semiconductors
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Rochester.
Rochester didn’t post a salary, so this is our estimate from similar listings.
18% below the average for this role