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© All Rights Reserved. ApplyBlast.com
macom
MACOM is seeking a Packaging Engineer Intern to assist with packaging bumped ICs to meet customer, reliability, and manufacturing specifications. The role involves tasks such as bump mask design, substrate design, thermal analysis, and design reviews. Interns will work on a defined project with set outcome goals over a 12-week period.
Headquarters
Lowell, Massachusetts, United States
Company Size
1001-5000 employees
Founded
1950
MACOM designs and manufactures high‑performance semiconductor products for the Telecommunications, Industrial & Defense, and Data Center industries. The company specializes in RF/microwave and mmWave components and subsystems—such as amplifiers, switches, mixers and other high‑frequency building blocks—used in wireless infrastructure, radar/satellite, and optical/data‑center links. MACOM supplies OEMs and system integrators with reliable, high‑performance analog semiconductor solutions for demanding communications, sensing, and high‑speed data applications worldwide.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for macom.
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