FABCRAFT
The Packaging Engineering Intern role at fab2 involves hands-on research and development of semiconductor packaging technologies, including mechanical prototyping, experiment design, and data analysis. The intern will design and iterate on machines and subsystems for fabrication, integrate mechanical, electrical, and optical components, and collaborate with cross-functional teams to improve processes. This position offers exposure to end-to-end process development in a small, fast-paced team environment.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for FABCRAFT.
98% above the average for this role