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© All Rights Reserved. ApplyBlast.com
Qualcomm Incorporated
This role is part of Qualcomm's Integrated Circuits package engineering process team, providing mechanical simulation support for current and future chipsets. The position focuses on developing mechanical FEA models and performing stress analysis for IC package designs and failure prediction. Collaboration with design, NPI, and CPI teams is essential to advance packaging technologies.
Headquarters
San Diego, California, United States
Company Size
10001+ employees
Founded
1985
Qualcomm is a global semiconductor and telecommunications company that designs wireless technologies and platform solutions, best known for its Snapdragon mobile SoCs, 5G modems, and RF front‑end components. The company focuses on high‑performance, low‑power computing and on‑device AI, as well as unrivaled connectivity to enable smartphones, automotive systems, XR, IoT, and edge applications. Qualcomm pairs chip design and system software with extensive patent licensing and a broad OEM/developer ecosystem to accelerate industry transformation through 5G, AI, and “intelligent computing everywhere.”
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Qualcomm Incorporated.
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