Packaging Module Development Engineer
Intel(1 month ago)
About this role
Process Development Engineer role within a technology development organization focused on semiconductor assembly/packaging processes such as die/DRAM attach, component attach, solder ball attach, and deflux. The position supports development and qualification of new processes and materials for new products, shuttle programs, test vehicles, and foundry products in a factory network environment.
Required Skills
- Process Development
- Process Engineering
- Semiconductor Packaging
- Solder Ball Attach
- Chip Attach
- NPI
- DOE
- SPC
- FMEA
- Data Analysis
+6 more
Qualifications
- MSc
- MEng
- BEng
About Intel
intel.comIntel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
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