Packaging Module Development Engineer
Intel(1 month ago)
About this role
The Packaging Module Development Engineer at Intel's Advanced Packaging Technology Manufacturing (APTM) contributes to the development and commercialization of semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. The role sits within the Assembly Technology Development team and supports scaling innovative package interconnect and thermal solutions for high-volume Intel Foundry manufacturing.
Required Skills
- Packaging
- Interconnect
- Thermal Solutions
- Materials Science
- Process Development
- Project Management
- SPC
- DOE
- Reliability
- Equipment Support
Qualifications
- PhD
- Minimum GPA 3.5
- Publication in Peer-Reviewed Journal
About Intel
intel.comIntel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
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