Packaging Module Development Engineer
Intel(6 days ago)
About this role
An experienced engineer in the Intel Board Assembly Technology Development team focuses on process and materials development for SMT processes and PCBs. The role involves developing solutions for next-generation products, integrating new processes, and contributing to technology roadmaps, all within Intel's packaging and assembly domain.
Required Skills
- SMT
- PCB
- Process Development
- Materials Science
- Failure Analysis
- X-ray Inspection
- AOI
- Data Analysis
- Materials Characterization
- Process Optimization
About Intel
intel.comIntel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
View more jobs at Intel →Apply instantly with AI
Let ApplyBlast auto-apply to jobs like this for you. Save hours on applications and land your dream job faster.
More jobs at Intel
Similar Jobs
Module Packaging Manager
Monolithic Power Systems(1 month ago)
SMT Engineering Coordinator
Astemo(8 months ago)
SMT Process Engineer IV
Jabil(11 days ago)
PCBA Manufacturing Tech
Hyve Solutions(5 months ago)
Surface Mount Technician-2nd shift SMT
Example Corp(2 months ago)
Senior Power Module Assembly Engineer
Monolithic Power Systems(19 days ago)