Packaging Module Development Engineer

Intel

1 month ago

3.7 on Glassdoor

Kulim, Malaysia

Onsite

Full Time

Senior

0 applicants

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About this role

The Packaging Module Development Engineer at Intel focuses on process and materials technology development for surface mount technology (SMT) processes and printed circuit boards (PCBs). The role involves developing and validating assembly processes, improving manufacturing techniques, and contributing to future technology roadmaps within Intel's packaging and assembly teams.

Skills

Qualifications

Bachelor's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Mechatronics, or Applied Physics4+ years experience in semiconductor IC assembly

About Intel

intel.com

Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.

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