Packaging Module Development Engineer
Intel(6 days ago)
About this role
The Packaging Module Development Engineer at Intel focuses on process and materials technology development for surface mount technology (SMT) processes and printed circuit boards (PCBs). The role involves developing and validating assembly processes, improving manufacturing techniques, and contributing to future technology roadmaps within Intel's packaging and assembly teams.
Required Skills
- IC Assembly
- Reflow Soldering
- Surface Mount Technology
- 材料科学
- Process Development
- Failure Analysis
- X-ray Inspection
- AOI
- Statistical Analysis
- PCB Design
Qualifications
- Bachelor's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Mechatronics, or Applied Physics
- 4+ years experience in semiconductor IC assembly
About Intel
intel.comIntel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
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