Packaging Module Development Engineer
Intel(4 days ago)
About this role
A Packaging Module Development Engineer at Intel focuses on developing and validating surface mount technology processes for circuit board assembly in the production of advanced CPU and chipset packages. The role supports next-generation product development through process optimization, defect analysis, and technology documentation.
Required Skills
- SMT
- PCB
- Process Development
- Data Analysis
- X-ray Inspection
- AOI
- Statistical Analysis
- Materials Science
- Circuit Board Technology
- Automation
About Intel
intel.comIntel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
View more jobs at Intel →Apply instantly with AI
Let ApplyBlast auto-apply to jobs like this for you. Save hours on applications and land your dream job faster.
More jobs at Intel
Similar Jobs
Module Packaging Manager
Monolithic Power Systems(1 month ago)
Senior Power Module Assembly Engineer
Monolithic Power Systems(19 days ago)
Surface Mount Technician-2nd shift SMT
Example Corp(2 months ago)
SMT Engineering Coordinator
Astemo(8 months ago)
Senior Power Module Assembly Engineer (South Korea)
Monolithic Power Systems(2 days ago)
Advanced Packaging Engineer - SI/PI
Marvell Technology(1 month ago)