Intel
As a Packaging Module Development Engineer at Intel, you will lead the innovation and optimization of advanced semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. The role involves developing interconnect solutions, optimizing assembly processes, and characterizing equipment using statistical techniques to ensure high-volume manufacturability and reliability. You will collaborate with cross-disciplinary teams and suppliers to advance next-generation materials and fabrication techniques while managing complex technical projects.
Headquarters
Santa Clara, California, United States
Company Size
10001+ employees
Founded
1968
Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
Mackenzie Financial Corp Buys 377,676 Shares of Intel Corporation $INTC
3 hours ago
Intel introduces Core Series 2 Processor, expands edge AI portfolio
32 minutes ago
Intel Corporation (INTC) is a leading American manufacturer of semiconductor computer circuits . It is headquartered in Santa Clara , California. The company’s name comes from integrated electronics.
5 days ago
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Intel.
29% above the average for this role
Intel shareholder sues over 10% stake deal with U.S. government - report (INTC:NASDAQ)
6 hours ago
Module Integration Engineer
Samsung US
Module Integration Engineer
Samsung US
Advanced Packaging Process Engineer III E3)
Applied Materials
Module Packaging Manager
Monolithic Power Systems
Member of Technical Staff (MTS) of Advanced Packaging & Module Engineering
SkyWater Technology Foundry, Inc.
Die-to-Wafer Hybrid Bonding Module Engineer
Applied Materials