Packaging Module Development Engineer

Intel is hiring a mechanical engineer on the Advanced Packaging Mechanical Analysis team in Chandler, AZ, to develop multiphysics thermo-mechanical simulations for advanced semiconductor packaging. The role involves validating finite element analysis (FEA) models, collaborating with cross-functional teams, and designing lab tests to evaluate stress, thermal cycling, and reliability risks across various package architectures. This position drives strategic development activities by bridging experimental methods and numerical simulations to solve complex engineering problems at the forefront of semiconductor innovation.