Intel
The Packaging Module Development Engineer role focuses on process, equipment, and materials technology development for Surface Mount Technology (SMT) processes and Printed Circuit Boards (PCBs) within Intel's Assembly Technology Development team. This position involves developing and validating board assembly process solutions to meet next-generation product requirements, including creating SMT process solutions for IC packages and sockets. The role requires identifying root causes of defects, optimizing processes, and contributing to technology roadmaps for SMT and PCB advancements.
Headquarters
Santa Clara, California, United States
Company Size
10001+ employees
Founded
1968
Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
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Intel Corporation (INTC) is a leading American manufacturer of semiconductor computer circuits . It is headquartered in Santa Clara , California. The company’s name comes from integrated electronics.
5 days ago
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Intel.
Intel didn’t post a salary, so this is our estimate from similar listings.
Right around the average for this role
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