Packaging Module Equipment Development Engineer
Intel(7 days ago)
About this role
The packaging module equipment development engineer focuses on developing and optimizing assembly processes and equipment for semiconductor packaging. The role involves designing innovative solutions to improve manufacturing efficiency, quality, and reliability of packaging technologies, while collaborating with suppliers and supporting equipment sustainment. It requires hands-on experience and research in equipment support within the semiconductor industry.
Required Skills
- equipment Support
- Process Development
- Design of Experiments
- Statistical Process Control
- Semiconductor Manufacturing
- Packaging Technologies
- Equipment Selection
- Yield Optimization
- Reliability Testing
- Material Specifications
About Intel
intel.comIntel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
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