ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.
© All Rights Reserved. ApplyBlast.com
ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.
© All Rights Reserved. ApplyBlast.com
Intel
The Packaging Module Equipment Development Engineer at Intel focuses on developing and optimizing advanced semiconductor packaging processes and equipment, supporting Intel's innovative packaging solutions for data centers and AI. The role emphasizes process improvement, reliability, and collaboration with suppliers to meet high-quality standards.
Headquarters
Santa Clara, California, United States
Company Size
10001+ employees
Founded
1968
Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
MarketBeatMackenzie Financial Corp Buys 377,676 Shares of Intel Corporation $INTC
3 hours ago
eeNews EuropeIntel introduces Core Series 2 Processor, expands edge AI portfolio
32 minutes ago
BritannicaIntel Corporation (INTC) is a leading American manufacturer of semiconductor computer circuits . It is headquartered in Santa Clara , California. The company’s name comes from integrated electronics.
5 days ago
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Intel.
Intel shareholder sues over 10% stake deal with U.S. government - report (INTC:NASDAQ)
6 hours ago
Senior Principal Packaging Engineer
Macomtech Oy
2.5D/3D Process Development Engineer
Marvell Technology
Packaging Development Engineer
Analog Devices Inc.
Principal Packaging Engineer
GovernmentJobs
Senior Process Engineer - Semiconductor Assembly & Packaging
Talent Solutions
Senior Process Engineer - Semiconductor Assembly & Packaging
Talent Solutions
