Packaging Module Process Development Engineer
Intel(10 days ago)
About this role
The Packaging Module Equipment Development Engineer at Intel focuses on developing and optimizing advanced semiconductor packaging processes and equipment, supporting Intel's innovative packaging solutions for data centers and AI. The role emphasizes process improvement, reliability, and collaboration with suppliers to meet high-quality standards.
Required Skills
- semiconductor
- Process Development
- Statistical Analysis
- Equipment Engineering
- Materials Development
- FMEA
- DOE
- Manufacturing
- Packaging Technology
- Reliability
About Intel
intel.comIntel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
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