Packaging & Testing Engineer

The Packaging & Testing Engineer supports translational semiconductor research by bridging advanced packaging process development with industry-relevant manufacturing practices. This role focuses on operational engineering control of back-end processes, including backgrinding, wafer dicing, molding, and package-level testing, to ensure process robustness, yield performance, and scalability. The position plays a key role in enabling advanced packaging integration, reliability validation, and high-yield manufacturing through joint development programs and technology transfer activities.