Micron Technology
The PDE API Process Integration (PI) Engineer drives process integration excellence for Advanced Packaging products, including High Bandwidth Memory (HBM), during New Product Introduction. This role ensures robust process readiness, yield ramp, and cross-module integration across Front-end to Assembly interactions, PWF, Assembly, and Test. The engineer collaborates cross-functionally to identify risks, resolve complex integration issues, and deliver NPI milestones on time.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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