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oraclecloudinfrastructure
The PIC Process Integration Engineer leads the bring-up and qualification of a new Indium Phosphide (InP) photonics semiconductor fabrication facility at Nokia. This role focuses on establishing high-yield, scalable, and reliable photonic device manufacturing processes in a cutting-edge fab environment. The position requires expertise in InP or compound semiconductor process development, fab tool qualification, and yield improvement.
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Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for oraclecloudinfrastructure.