Plating Equipment Engineer
Broadcom(27 days ago)
About this role
An Equipment Engineer on the Finish Team (Bond, CMP, Plating) for Broadcom’s Wireless Semiconductor Division, based in Northern Colorado. The role supports equipment used to develop and execute advanced processes in an 8" wafer fabrication facility and collaborates with Technology Development and Process Engineering on new materials and device architectures. The position contributes to preparing equipment and processes for manufacturing deployment.
Required Skills
- Equipment Optimization
- Troubleshooting
- Preventative Maintenance
- Process Engineering
- Statistical Process Control
- Fault Detection
- Data Analysis
- DOE
- JMP
- Minitab
+2 more
Qualifications
- BS in ME, EE, ChemE, or Materials Science
- U.S. Work Authorization
About Broadcom
broadcom.comBroadcom Inc. is a global technology leader that designs, develops, and supplies a comprehensive range of semiconductor and enterprise software solutions. The company's offerings include a variety of security solutions and products aimed at enhancing connectivity across various sectors. With a commitment to innovation and quality, Broadcom is at the forefront of driving technological advancements that connect everything, from data centers to mobile devices.
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