Principal CMP Process Engineer
NXP Semiconductors(6 months ago)
About this role
Process Engineer position supporting the formation of the VSMC joint venture between NXP and VIS, working in a high-volume 300mm wafer manufacturing environment. The role is centered on CMP and wafer bond process domains within the semiconductor fab and interfaces with cross-functional teams during the JV setup and operations.
Required Skills
- CMP
- Wafer Grind
- Wafer Bond
- MIRRA
- IPEC
- Disco Grinder
- SPC
- FDC
- DOE
- Fault Detection
+5 more
Qualifications
- BS in Electrical Engineering
- BS in Materials Science
- BS in Solid State Physics
About NXP Semiconductors
nxp.comNXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.
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