Principal Design Engineer, TSV Packaging
Eightfold(2 months ago)
About this role
Micron Technology is seeking an experienced Design Engineer to join their TSV Packaging team, focusing on the design and analysis of high-performance memory devices. This role involves utilizing finite element analysis to innovate and create advanced semiconductor packages, driving the development of next-generation products. Collaboration with global teams is essential to analyze and improve manufacturing processes in this cutting-edge technology environment.
Required Skills
- Finite Element Analysis
- Semiconductor Packaging
- ANSYS
- Collaboration
- Project Development
Qualifications
- M.S. / Ph.D. in Mechanical Engineering
- Material Science
- or related Engineering field
About Eightfold
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