Principal Engineer, Advanced Packaging
Eightfold
About this role
A Principal Engineer at Micron Technology's Advanced Packaging Technology Development team shapes next-generation semiconductor packaging technologies. This role impacts product quality, reliability, yield, and cost through cross-disciplinary collaboration, innovation, and leadership.
Skills
Qualifications
About Eightfold
eightfold.aiMaximize your workforce's potential with our advanced AI Talent Intelligence Platform for talent acquisition and development. Unlock the full potential of your workforce today.
Recent company news
AI company Eightfold sued for helping companies secretly score job seekers
Jan 21, 2026
AI company Eightfold sued for helping companies secretly score job seekers
Jan 21, 2026
Job Applicants Sue to Open ‘Black Box’ of A.I. Hiring Decisions
Jan 21, 2026
Job seekers are suing an AI hiring tool used by Microsoft and Paypal
1 month ago
AI Hiring Under Fire: The Eightfold Lawsuit Explained
1 month ago
About Eightfold
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
Unlock Company Insights
View leadership team, funding history,
and employee contacts for Eightfold.
Salary
$139k – $201k
per year
More jobs at Eightfold
Similar Jobs
Advanced Packaging Process Integration Principal/ Staff Engineer
Applied Materials
Senior Process Engineer - Advanced Packaging
ASM
Packaging Module Development Engineer
Intel
Principal Engineer, Hardware - Advanced Packaging
ASM
(Senior) Principal Engineer, Advanced Packaging
ASM
Advanced Packaging Modeling Expert - FEA
Applied Materials