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Principal Engineer, BSP at Harman International - ApplyBlast

Principal Engineer, BSP

Harman International

3 days ago

Chengdu, Sichuan, China

Hybrid

Full Time

Senior

0 applicants

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About this role

The Principal Engineer, BSP supports the development of Cockpit and Central Compute platforms by collaborating with SoC suppliers, hardware teams, and application teams to deliver high-performance automotive software. The role involves developing, integrating, and maintaining BSP, kernel, and device driver software across Linux, Android, and QNX operating systems. This position focuses on platform bring-up, performance optimization, and resolving complex system issues to enhance in-vehicle infotainment and safety technologies.

Responsibilities

Develop and maintain BSP, kernel, and device driver software for automotive platforms
Support platform bring-up, board support package customization, and performance optimization
Debug software across Linux, Android, and QNX operating systems to resolve complex system issues