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Principal Engineer, Embedded Software Engineering at Harman International - ApplyBlast

Principal Engineer, Embedded Software Engineering

Harman International

2 days ago

Shanghai, Shanghai, China

Onsite

Full Time

Senior

0 applicants

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About this role

The BSP & Kernel Software Engineer develops, integrates, and optimizes low-level platform software for next-generation Cockpit and Central Compute products. This role focuses on Qualcomm automotive platforms, requiring expertise in Linux, Android, or QNX kernel development and BSP bring-up. The position involves collaborating with SoC suppliers, hardware teams, and OEM customers to deliver production-ready automotive software solutions.

Responsibilities

Develop and maintain BSP, kernel, and device driver software for automotive platforms
Support platform bring-up, performance optimization, and production software releases
Collaborate with cross-functional teams to resolve complex system issues and troubleshoot