Principal Engineer Hig Hbm Architecture Richardson Texas United States Of America

micron

1 month ago

Onsite

Full Time

Senior

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About this role

A Principal Engineer at Micron Technology specializes in designing and developing next-generation HBM DRAM products. The role involves creating innovative memory subsystem architectures for AI/ML solutions and collaborating with internal and external partners to define and implement advanced memory technologies.

Skills

Qualifications

Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related fieldMinimum of 10 years of experience in memory subsystem architecture and designDeep understanding of memory controller design and memory types (DDR, LPDDR, GDDR, HBM)Experience with PHY design and understanding of signal integrity issuesProficiency in Network-on-Chip (NoC) architecture and design

About micron

micron.com

Micron Technology, Inc. is a global leader in semiconductors. It provides a broad range of performance-enhancing memory and storage solutions. Headquartered in Boise, Idaho, Micron serves customers worldwide with its memory and storage products. The company is recognized for its global reach and leadership in the semiconductor industry.