ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.
© All Rights Reserved. ApplyBlast.com
ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.
© All Rights Reserved. ApplyBlast.com
Micron Technology
Micron Technology is seeking a Principal HBM IO Architecture Design Engineer to develop and optimize high-speed memory interface solutions for AI and ML applications. The role involves working on circuit design, analysis, and collaboration with multidiscipline teams to ensure successful product development.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Micron Technology.
Senior Mixed Signal Design Engineer Taiwan Hsinchu
NVIDIA
Mixed Signal Design Engineer (RDSS Intern)
NVIDIA
Senior Mixed-Signal/Analog/IO Circuit Design Engineer
Coherent
Senior Mixed Signal Design Engineer Us Ca Santa Clara
NVIDIA
Mixed Signal Design Engineer (RDSS Intern)
NVIDIA
Mixed Signal Circuit Designer (RDSS Intern)
NVIDIA