Principal Engineer - Silicon Packaging Architect

Intel(1 month ago)

HybridFull TimeSenior$220,920 - $311,890Engineering

About this role

Intel’s Central Engineering Group is hiring a Silicon Packaging Architect to connect silicon design with advanced packaging for next-generation server SoCs and DDR PHY interface solutions. The role sits within Intel’s Silicon Engineering organization and focuses on delivering high-performance, cost-effective architectures across multiple US sites. It is an experienced individual-contributor position supporting custom silicon and platform development for Intel products and customers.

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Required Skills

Silicon Packaging
Package Co-Design
DDR PHY
SoC Architecture
Mixed-Signal Design
Bump Mapping
Floor Planning
Signal Integrity
Power Integrity
Package Extraction

+7 more

Qualifications

BS in Electrical Engineering
BS in Chemical Engineering
BS in Mechanical Engineering
BS in Materials Science
MS (Preferred)
PhD (Preferred)

About Intel

intel.com

Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.

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