Principal Material Engineer
Eightfold(1 month ago)
About this role
A Package Materials Engineer in Micron’s Advanced Packaging Technology Development (APTD) organization focuses on developing and selecting materials and integrating them into 3D integrated packaging solutions for next-generation semiconductor products. The role centers on materials and process development to meet packaging requirements and support technology transfer to high-volume manufacturing. The engineer is expected to provide technical leadership, work independently, and guide cross-functional teams toward program objectives.
Required Skills
- Materials Characterization
- FT-IR
- XPS
- ToF-SIMS
- TMA
- DSC
- TGA
- Warpage Analysis
- CSAM
- Shear Testing
+10 more
Qualifications
- Ph.D in Chemistry, Physics, Materials or Related Field
About Eightfold
eightfold.aiMaximize your workforce's potential with our advanced AI Talent Intelligence Platform for talent acquisition and development. Unlock the full potential of your workforce today.
View more jobs at Eightfold →Apply instantly with AI
Let ApplyBlast auto-apply to jobs like this for you. Save hours on applications and land your dream job faster.
More jobs at Eightfold
Similar Jobs
Materials Analysis Engineer
Prysmian(2 months ago)
Laboratory Analyst
Shell plc(11 days ago)
Sr Engineer, Chemical Materials Engineering (Onsite)
RTX(28 days ago)
Senior Packaging Materials R&D Engineer
Monolithic Power Systems(1 month ago)
Polymer Characterization and Thermal Analysis Research Associate
The Aerospace(1 month ago)
Internship (d/f/m) within Technology Center ECOMAT
Acubed(29 days ago)