ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.

Features

Auto Apply Resume Optimizer Cover Letter Optimizer Interview Prep

Company

Social Media

Need Help?

team@applyblast.com

Principal Package Design Engineer – R&D (Discrete / Power) at Nexperia - ApplyBlast

Principal Package Design Engineer – R&D (Discrete / Power)

Nexperia

5 months ago

3.6 on Glassdoor

Seremban

Onsite

Full Time

Senior

0 applicants

View Job Listing

Apply to 100+ jobs

About this role

A Principal Package Design Engineer supports new semiconductor package development and continuous design improvement, focusing on discrete packages and ensuring robust, manufacturable, and cost-effective package designs.

Responsibilities

Lead and support lead frame package design for NPI and mass production phases
Develop technical assembly drawings with Package Architects
Define dimensions and tolerances based on assembly capability and package technology
Ensure compliance with industry standards such as JEDEC and AEC-Q100/Q101
Apply understanding of semiconductor assembly processes including die attach, wire bonding, and molding

Skills

Qualifications

Bachelor’s or master’s degree in mechanical, Electronics, Manufacturing Engineering, or related discipline

About Nexperia

nexperia.com

Headquarters

Nijmegen, Gelderland, Netherlands

Company Size

10001+ employees

View Profile

Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.