Principal Package Thermal & Mechanical Engineer

Astera Labs

3 days ago

4.3 on Glassdoor

United States

Onsite

Full Time

Senior

0 applicants

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About this role

A Principal Package Thermal & Mechanical Engineer at Astera Labs develops and models advanced IC packaging solutions for next-generation AI and high-performance connectivity systems. The role involves defining thermal and mechanical modeling strategies, influencing package architecture, and collaborating with cross-functional teams to ensure robust performance.

Skills

Qualifications

M.S. or Ph.D. in Mechanical Engineering, Materials Science, Electrical Engineering, or related field8+ years of experience in semiconductor packaging with strong focus on thermal and mechanical modelingDeep expertise in thermal modeling and simulationDeep expertise in thermo-mechanical modeling and FEA simulationProven ability to correlate simulation results with lab measurements

About Astera Labs

asteralabs.com

Astera Labs is a semiconductor company that builds purpose‑built connectivity silicon and system solutions for rack‑scale AI and modern data centers. They design high‑speed retimers, PHY/connectivity devices, interposers and companion firmware/software that extend signal reach, improve link reliability, and enable PCIe/CXL and other accelerator interconnects across cables and backplanes. Astera’s products add telemetry, error monitoring and management features to simplify integration for OEMs, cloud providers and hyperscalers. The company focuses on enabling scalable, low‑latency multi‑node AI training and inference systems.