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© All Rights Reserved. ApplyBlast.com
Semiconductor Manufacturing International
As a Principal Engineer in IC Package Design and Signal Integrity, you will lead the design and electrical characterization of advanced high-speed IC packages for Semtech's Datacenter connectivity portfolio. The role involves performing 3D signal integrity modeling, developing PCB and substrate layouts, and serving as a technical authority on package-level signal and power integrity. You will collaborate with cross-functional teams and external manufacturing partners to drive new product introductions and advance the company's packaging roadmap.
中芯国际是世界领先的集成电路晶圆代工企业之一，也是中国大陆集成电路制造业领导者，拥有领先的工艺制造能力、产能优势、服务配套。
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Semiconductor Manufacturing International.
16% above the average for this role
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