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Home | Ultra-Low-Power Infrastructure for the AI Era
Velaura is seeking a Principal Packaging Engineer to lead package architecture and development for next-generation SoCs, guiding projects from concept through production. This role involves collaborating with cross-functional teams to optimize performance, power, cost, and manufacturability while ensuring high-quality signal and power integrity. The position requires deep expertise in advanced semiconductor packaging technologies and a strong ability to balance technical excellence with production constraints.
Delivering proven, breakthrough, ultra-low-power compute for cloud, edge, and physical AI applications.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Home | Ultra-Low-Power Infrastructure for the AI Era.
84% above the average for this role