Microsoft
This role leads the physical design methodology and tool flow for block, sub-chip, and full-chip levels, focusing on Place and Route, Static Timing Analysis, and Physical Verification. The incumbent develops convergence recipes, implements global clocking schemes, and manages IP collateral installation while guiding junior engineers through design reviews. Success requires deep expertise in semiconductor design principles, EDA tools, and scripting to deliver high-quality ASIC products.
Headquarters
Redmond, Washington, United States
Company Size
10001+ employees
Founded
1975
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Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Microsoft.
Microsoft didn’t post a salary, so this is our estimate from similar listings.
8% above the average for this role
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