Eightfold

Principal Thermal Simulation Engineer, APTD

Eightfold(2 months ago)

HybridFull TimeSenior$166,414 - $220,970 (estimated)Advanced Packaging Technology Development
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About this role

The Thermal Simulation Engineer at Micron Technology will be involved in developing advanced memory packaging technologies, focusing on thermal management to improve product performance. This role encompasses collaboration with multi-functional teams to address thermal aspects of advanced packaging development, leveraging simulation tools and methodologies to drive innovation in semiconductor products.

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Required Skills

  • Thermal Engineering
  • Finite Element Analysis
  • Simulation Tools
  • Advanced Packaging
  • Multi-Physics Modeling

Qualifications

  • M.S. in Mechanical Engineering
  • Ph.D. in Materials Science
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