Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)
Intel(1 month ago)
About this role
This is an experienced manufacturing/process engineering role within Intel Foundry focused on sustaining and scaling high-volume semiconductor assembly/packaging operations in Kulim, Malaysia. The position centers on enabling rapid device miniaturization and mass production through ownership of key equipment and process modules, supporting factory ramps and global technology transfer across manufacturing sites.
Required Skills
- Semiconductor Manufacturing
- Equipment Ownership
- Process Engineering
- SPC
- Data-Driven Problem Solving
- Metrology
- X-Ray Inspection
- Optical Inspection
- Microscopy
- Yield Improvement
+10 more
Qualifications
- Bachelor's Degree in Engineering
About Intel
intel.comIntel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
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