infineon
This role focuses on developing and optimizing semiconductor package singulation processes, including tape-based, tapeless, laser, and hybrid technologies, to meet project targets for quality, cost, and manufacturability. The position involves driving process qualification, supporting technical handover to operations, and maintaining comprehensive documentation such as PFMEA and Process Specifications. It also requires evaluating emerging technologies, mentoring engineers, and serving as the primary technical expert for package singulation solutions.
Infineon Technologies is a global semiconductor company that delivers chips and system solutions for automotive, industrial, IoT, and consumer markets. Its product portfolio includes microcontrollers, sensors, power-management ICs and power semiconductors (e.g., MOSFETs/IGBTs), memories, connectivity (USB, Bluetooth, Wi‑Fi), LED drivers, security controllers and radiation‑hardened devices. Infineon focuses on energy efficiency, safety and security to enable applications from electric vehicles and industrial drives to smart-home and IoT devices. OEMs and system designers choose Infineon for its integrated hardware/software solutions, reliability, and global support.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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and employee contacts for infineon.
infineon didn’t post a salary, so this is our estimate from similar listings.